With us You do
WORK THAT MATTERS

We are the most trusted partner imaging the unknown by creating foresight capabilities quicker to discover and prevent threats. Our solutions contribute to the improvement of people’s health and safety daily. With us you do work that truly matters.

We are a global provider of X-ray detector solutions and services for medical, security, and industrial applications. Our solutions range from sensor components to optimized detector subsystems with ASICs, electronics, mechanics, software, and algorithms.

Our net sales totalled EUR 101 million in 2025. We have around 700 active customers in over 40 countries. We employ around 500 people in Finland, China, India, France, and the US. Our company’s shares are listed on the Nasdaq First North Growth Market Finland.

We are looking for a skilled professional to join our global team in Beijing. We have an immediate opening for

Process Engineer

Your role

This position serves as process owner of Die Bonding(DB) process.

The primary objective is to provide technical support across the entire product lifecycle, including early R&D phase, NPI, and mass production for DB process. This role requires cross-functional collaboration with project management, R&D, production, and quality to develop processes for new products and support sample builds. The role also aims to deploy best manufacturing practices and tools to solve problems in cost-effective ways, monitor manufacturing process capabilities and capacities to support production, and drive continuous improvement in productivity, quality, and overall cost reduction.

Key activities include; new process development, design review in project, cycle time and capacity improvement, cost down, process capability improvement, process optimization, yield improvement, etc. and failure analysis and process issue trouble shooting.

Additional task and responsibilities as needed to fulfill department objectives

Key challenges include meeting targets in quality, cost, productivity and competence in process development for time to market requirement.

What we expect

Qualifications Bachelor degree or above, major in Microelectronics\electronics, mechanical engineering, semiconductor packaging.

At least 5+ years related experience on die bonding, flip chip process and equipment, have hands on experience on DB equipment, like Besi, ASM, etc

Able to understand drawings and specifications defined, measurement tools and result

Able to use SPC, FMEA, DOE, Tolerance design and other 6Sigma or quality tools to develop processes, CTQ etc. and set up volume production capability with control and metrics.

Able to use software like Creo to design process fixture is preferred

Able to do trouble shooting and find solution independently.

Data collection and analysis ability, problem detecting ability

Team oriented with strong focus on effective team working and multi-tasking capabilities.

Take initiatives, plan activities and projects with accountability to accomplish tasks to meet timeline.

Ability to work under pressure and independently to meet timeline.

Location

This position is based in Beijing China, with close collaboration with our global teams. You will be reporting to the Senior Manager, Process Engineering.

Our offer

Join us and contribute to a strategically vital area of growth, building innovative solutions that improve industrial efficiency and enhance safety. We provide a competitive salary and benefits package and a dynamic international working environment.

More information

Please, feel free to contact us for more information. We are happy to provide you further information.